Innovative electronics production

The supermodern full-cycle production line is designed by the principle of maximum automation and is intended to the manufacturing of high quality electronic devices of any complexity

icon-blue_head-5Maximally automated production

icon-green_5Process automated quality control

icon-blue_cropNutek laser marking system. PCB marking

ORDINARY PRODUCTION

  StarLine PRODUCTION

No marking

No identification of each PCB

No traceability and a product history

Labels

 Fragility of the labels

  PCB laser marking with the unique code

       100% durability

       Clear identification of each PCB

       Full traceability of a product lifecycle

icon-green_cropTeknek PCB cleaning system. Adhesive rollers remove micropollution from the PCB

ORDINARY PRODUCTION

PCB without cleaning

  Microparticles on the PCB surface

  Microdefects in solder joints

  StarLine PRODUCTION

  PCB before and after cleaning

      Teknek adhesive rollers remove micropollution from the PCB

      Cleaning provides high quality of the solder joints

icon-blue_cropPanasonic SP-70 screen printer. Accuracy of solder paste application is 20 microns

ORDINARY PRODUCTION

Hand-made or semiautomatic equipment

Production stops for solder paste adding

Paste verification either by a bare guess or after detection of assembly defects

Application speed and printing accuracy depend on operator’s skills

  StarLine PRODUCTION

  100% automation = 100% quality

      АAutomatic solder supply. Continuous solder printing

      Measurement of squeegee’s height on stencils. Stable quality

      Application speed is 12 sec. with printing accuracy of 20 microns

icon-green_crop3D Koh Young solder paste inspection. 3D inspection of solder paste volume

ORDINARY PRODUCTION

2D inspection of screen printer

  No control of solder oversupply or shortage

  Low productivity

No solder paste inspection

No quality control

The application defects result in spoilage of the mounted products

  StarLine PRODUCTION

  3D Koh Young solder paste inspection

      3D measurement and defect detection of solder paste application:

      100% 3D quality control of solder paste application in accordance with IPC 610 requirements

icon-blue_cropHigh-performance Panasonic NPM-W pick and place modular system. Velocity of up to 210 000 cph

ORDINARY PRODUCTION

Small-scale or medium-scale pick and place systems

  Placement accuracy of 50-150 microns

  Low velocity

  StarLine PRODUCTION

  High-performance Panasonic NPM-W pick and place modular system

       Placement of components with 01005 size

      Velocity of up to 210 000 cph with placement accuracy of 20 microns

      Placement of connectors on the Pin&Paste technology

      Placement of components with non-standard shape

icon-blue_cropSenju SNR-1065 convection oven. 10 heater zones, 2 cooling zones

ORDINARY PRODUCTION

Convection oven

 No active cooling

 Unstable temperatures

 High power consumption

  StarLine PRODUCTION

  Senju SNR-1065 convection oven

       High quality solder joints due to active cooling

      Use of PB-free technology

      Stable temperatures in the zones of ±1°C

      Energy efficiency and environmental friendliness

icon-green_cropKoh Young Zenith 3D Automated Optical Inspection 100% quality control

ORDINARY PRODUCTION

Visual inspection

  Human-factor dependence

  Low productivity

2D inspection

  No component height measurement

  False alarm

  StarLine PRODUCTION

  Koh Young Zenith 3D AOI inspection

      High-speed 3D camera

      Component height and volume measurement

      Component inspection in accordance with IPC-A-610 standards

icon-blue_cropAutomatic PCB separator SAR-1300 Disk and milling PCB separating

ORDINARY PRODUCTION

  StarLine PRODUCTION

Manual PCB separating

 Possible damage of components
(microcracks)

 Low productivity

Semi-automatic PCB separating

 Possible PCB damage

  Automatic PCB separating SAR-1300

       High accuracy and repeatability of the separation

      Separation by means of disk and milling cutter

      ESD protection

icon-green_cropX-ray control. Quality control of the solder joints

ORDINARY PRODUCTION

No X-ray control

  No quality control of mounted complex components such as BGA, QFP, FlipChip, etc.

  No quality control of the solder joints

  StarLine PRODUCTION

  X-ray control

      Quality control of mounted complex components such as BGA, QFP, FlipChip, etc.

      Quality control of the solder joints: short circuit, hollow spaces in solder joints

icon-blue_cropSuper Swash PCB washing

ORDINARY PRODUCTION

  StarLine PRODUCTION

PCB without washing

 Flux remaining on the PCB Risk of corrosion and white bloom

Ultrasonic washing

 Low productivity

 Need of additional operation: PCB drying

 Possible damage of crystals

  PCB before and after washing

       Automatic PCB washing

      Drying by heated air with the use of air knives

icon-green_cropFunctional testing

ORDINARY PRODUCTION

No functional testing

  Decrease in production of high-quality products

  Failure during operation

  StarLine PRODUCTION

  Functional product testing

      100% checking of products

      Guarantee of reliable work